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MessagePosté le: Ven Jan 08, 2021 12:22 pm  Répondre en citant



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High frequency PCB design precautions


With the rapid development of electronic technology and the wide application of wireless communication technology in various fields, high frequency, high speed and high density have gradually become one of the significant development trends of modern electronic products. High-frequency signal transmission and high-speed digitization force the PCB to move toward micro-holes and buried/blind holes, fine wires, and uniform thinning of dielectric layers. High-frequency high-speed and high-density multilayer PCB design technology has become an important research field. This article first briefly introduces the high-frequency circuit board, and then explains the wiring design of the high-frequency circuit board of the PCB design. Finally, it introduces the precautions for the high-frequency circuit board layout of the PCB design. Let's take a look at the small series.To get more news about Halogen Free PCB, you can visit pcbmake official website.
High-frequency circuit wiring should pay attention to the "crosstalk" introduced by the parallel lines of the signal lines. Crosstalk refers to the coupling phenomenon between signal lines that are not directly connected. Since the high-frequency signal is transmitted along the transmission line in the form of electromagnetic waves, the signal line acts as an antenna, and the energy of the electromagnetic field is emitted around the transmission line, and an undesired noise signal generated by the mutual coupling of the electromagnetic fields between the signals is generated. Called Crosstalk. The parameters of the PCB layer, the spacing of the signal lines, the electrical characteristics of the driver and receiver, and the termination of the signal line all have a certain impact on crosstalk. Therefore, in order to reduce the crosstalk of high-frequency signals, it is required to do the following as much as possible during wiring:
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